ESREF 2022
33rd European Symposium on Reliability of Electron
Devices Failure Physics and Analysis
September 26-29, 2022
ORGANIZING COMITTEE
STEERING COMMITTEE
Conference Chair
Martin Schneider-Ramelow
TU Berlin and Fraunhofer IZM (D)
Conference Co-Chairs
Andreas Middendorf, Fraunhofer IZM (D)
Olaf Wittler, Fraunhofer IZM (D)
Technical Program Chairs
Francesco Iannuzzo, University of Aalborg (DK)
Frank Altmann, Fraunhofer IMWS (D)
Matteo Meneghini, University of Padova (I)
François Marc, University of Bordeaux (F)
Olaf Wittler, Fraunhofer IZM (D)
Industrial Advisory Board Chair
Stefan Wagner, Fraunhofer IZM, Berlin (D)
Tutorial Chair
Gudrun Feix, ECPE, Nürnberg (D)
Conference Office
Martina Creutzfeldt, mcc Agentur für Kommunikation GmbH (D)
Ajda Omrani, mcc Agentur für Kommunikation GmbH (D)
Stefan Ast, Fraunhofer IZM (D)
F. Altmann, Fraunhofer IMWS (D)
M. Bafleur, LAAS-CNRS (F)
A. Bensoussan, TAS (F)
C. Boit, TUB – Tech. University of Berlin (D)
G. Busatto, University of Cassino (I)
M. Ciappa, ETH, Zürich (CH)
O. Crepel, AIRBUS (F)
Y. Danto, IMS, University of Bordeaux (F)
I. de Wolf, IMEC (B)
G. Erikson, GRUNDFOS (DK)
F. Fantini, University of Modena (I)
Ph. Galy, ST Microelectronics (France)
W. Gerling, ECPE (D)
R. Heiderhoff, University of Wuppertal (D)
F. Iannuzzo, University of Aalborg (DK)
N. Labat, IMS, University of Bordeaux (F)
J.R. Lloyd, University of Albany (USA)
M. Meneghini, University of Padova (I)
E. Miranda, University Autonoma Barcelona (E)
E. Olthof, NXP Semiconductors (NL)
G. Papaioannou, University of Athens (G)
Ph. Perdu, ANADEF (F)
C. Salm, University of Twente (NL)
A. Toubul, IMS, University of Bordeaux (F)
M. Vanzi, University of Cagliari (I)
W. Wondrak, Daimler Chrysler (D)
TRACK CHAIRS
Track A – Assessment Techniques and Methods for Devices and Systems |
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| Johannes Jaeschke | Fraunhofer IZM Berlin | Germany |
| Edgar Olthof | NXP Semiconductors | Netherlands |
| Cora Salm | University of Twente | Netherlands |
Track B – Semiconductor and Nanoelectronics Technologies |
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| Eckhard Langer | Globalfoundries | Germany |
| Alain Bravaix | ISEN-Toulon | France |
Track C – Progress in Failure Analysis Methods |
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| Pascal Gounet | STMicroelectronics | France |
| Giovanna Mura | DIEE University of Cagliari – Italy | Italy |
Track D – Microwave Devices and Circuits |
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| Michael Dammann | Fraunhofer | Germany |
| Nathalie Labat | IMS Laboratory, Université de Bordeaux | France |
Track E – Packaging and Assemblies
E1 – Wafer- and Panel-Level & E2 – Second-Level Interconnects |
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| Hélène Fremont | IMS Laboratory, Université de Bordeaux | France |
| Paolo Cova | Università di Parma | Italy |
| Alexandrine Guédon-Gracia | IMS Laboratory, Université de Bordeaux | France |
| Matthias Hutter | Fraunhofer IZM Berlin | Germany |
Track F – Power Devices and SystemF1 – Smart Power Devices, IGBT, Thyristors |
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| Mauro Ciappa | ETH Zurich | Switzerland |
| Chiara Corvasce | Hitachi Energy | Switzerland |
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F2 – Wide Bandgap Power Devices |
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| Eckart Hoene | Fraunhofer IZM Berlin | Germany |
| Loic Theolier | Univ. Bordeaux | France |
| F3 – Power Electronic Systems | ||
| Olivier Crepel | AIRBUS | France |
| Hong Li | Beijing Jiaotong University | China |
Track G – Photonics Devices |
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| Yannick Deshayes | IMS Laboratory, Université de Bordeaux | France |
| Massimo Vanzi | CNR | Italy |
Track H – MEMS and Sensors |
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| George Papaioannou | University of Athens | Greece |
Track I – Extreme Environments and Radiation |
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| Tristan Dubois | IMS Laboratory | France |
| Rüdiger Hild | Baker Hughes | Germany |