Sovereignty and chips – How microelectronics opens up new horizons
The existence of an efficient, innovative, resilient, and sustainable semiconductor industry is in the strategic interest of Germany and Europe. The semiconductor industry plays the important role of supplying the downstream industries. Its progressive and targeted expansion contributes indispensably to a high degree of technological sovereignty and to the achievement of social, economic, and ecological goals. With a strong semiconductor industry, Europe’s interests must be implemented through functioning international trade relations and, at the same time, a high degree of industrial resilience must be realised to ensure independent decisionmaking. To achieve this, the existing technological strengths in Germany and Europe must be expanded and weaknesses must beaddressed in a targeted manner.
Dr. Gunther Kegel has been a member of the ZVEI Board of Directors since 1998. From 2007 to 2019 he was also Chairman of the ZVEI Automation Divsion. Overall, Dr. Kegel has been involved in the ZVEI since 1992.
He holds a PhD in electrical engineering from the Technical University of Darmstadt and is Chairman of the Executive Board of Pepperl+Fuchs SE. He has held various positions for the manufacturer of electronics for factory and process automation, including head of the Factory Automation Division, deputy CEO and managing director.
From 2016 to 2020 he was VDE President. He is chairman of the exhibitor advisory board of the Hannover Messe and a member of the DIN Executive Committee since 2021.
Dr. Gunther Kegel
Bridging across domains: Reducing escapes and optimizing costs by utilizing inline manufacturing inspection data to complement test
As semiconductor devices become more complex, it is increasingly difficult for any one segment of the manufacturing supply chain to unilaterally make the necessary improvements to meet reliability targets. Information sharing across the traditional data silos of test and inline (fab) defect inspection can bring together unique, yet highly-correlated, data—creating “1 + 1 > 2” synergies for die disposition decisions. Recent advances in high-speed fab inspection equipment has made inline defect screening at a handful of steps more feasible and cost-effective. As this methodology becomes commonplace in automotive fabs, innovative methods for combining outlier defect and test data have emerged. This paper will provide an overview of the concept, methodology, and results from such use cases.
David Price has worked at KLA Corporation for 25 years in a variety of technical and management positions. In his current role, Dr. Price works with semiconductor fabs, car makers, and tier 1 suppliers to develop new solutions which seek to reduce the incidence of latent reliability defects and test escapes in automotive semiconductor devices. He holds a Ph.D. in Mechanical Engineering from the University of Texas at Austin and has published over 70 papers, 12 patents/pending in semiconductor process control.
David W. Price, Ph.D.
Sr. Director, Automotive Semiconductor Process Control Solutions
Achieving automotive quality and reliability targets on electric vehicle with wide-bandgap materials
Wide-bandgap (WBG) materials have the physical characteristics to meet the growing demand for higher efficiency electronics with less weight and better heat dissipation driven by car electrification. The question is how to manage new assembly and system integrated solutions based on WBG technologies in a market that requires very short industrialization cycles and fast volume ramp-up while maintaining the quality and reliability levels required by the automotive industry. This presentation elaborates on the main challenges associated with the deployment and industrialization of WBG materials for electric vehicle applications, and the evolution of the automotive market ecosystem.
Vicenzo graduated in Electronic Engineering in 2002 and has worked in failure analysis and quality assurance before becoming manager and then director of quality and reliability for the Power Discrete Group. His experience includes silicon-based transistor technologies such as low-voltage MOSFETs, superjunction high-voltage MOSFETs, IGBTs, and Bipolar, as well as new transistor technologies based on wide-bandgap materials.
ADG Quality & Reliability Director, STMicroelectronics