ESREF 2022
33rd European Symposium on Reliability of Electron
Devices Failure Physics and Analysis
September 26-29, 2022
Welcome to ESREF 2022 in Berlin!
ESREF 2022, the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, will take place in Berlin (Germany) from September 26-29, 2022 at the H4 Hotel Berlin Alexanderplatz.
This international symposium continues to focus on the newest developments and future prospects for quality and reliability management of materials, devices, and circuits for micro-, nano-, and optoelectronics. It provides a European forum for all aspects of reliability management and innovative analytical techniques for present and future electronic applications.
CONFERENCE CHAIRMAN
Prof. Dr.-Ing. Martin Schneider Ramelow
Director of Research Centre for Microperipheric Technologies at TU Berlin
and Director of Fraunhofer Institute for Reliability and Microintegration IZM, Berlin
A word from the Conference Chairs
We are delighted to host the ESREF 2022 in Berlin. After a long period of online events and social distancing, we are in good hope that this event will enable us to meet in person again and to share and promote new ideas longer lasting electronics. This is an important contribution to our society, because an increased lifetime will help to reduce CO2-emissions in electronics production and recycling. But reliability also enables electronics to be used in new applications in extremely harsh environments like space, transport, energy conversion and smart functions. Also this will help us to adress main future societal challenges. A special emphasis will be given on networking: The conference will be the ideal place to establish, reinvigorate and strengthen your contacts with scientists and engineers from all over the world. To make it easier to join us from abroad all session will be streamed live for online viewing.
SCOPE OF THE 2022 CONFERENCE
A - Assessment Techniques and Methods for Devices and Systems
Design for reliability; built-in reliability; virtual qualification; advanced seliability simulation; limits to accelerated tests; screening methods; yield/reliability relationship; counterfeit detection on system level; KI based reliability assessment; condition monitoring; multi-objective reliability assessment techniques; including sustainability aspects in the assessment; …
B - Semiconductor and Nanoelectronics Technologies
Process-related issues, passivation stability; hot carriers injection, NBTI, TDDB; high-K dielectrics and gate stacks; Low-K dielectrics and Cu interconnects; metal migration: mechanical and thermal aspects; non-volatile and programmable cells; silicon on insulator devices; nano-electronics, nano-electronic materials for solid state devices; …
C - Progress in Failure Analysis Methods
Electron, ion and optical beam techniques; scanning probe techniques; static or dynamic techniques, back-side techniques; acoustic microscopy; electric or magnetic field based techniques; electrical, thermal and thermo-mechanical characterization; sample preparation, construction analysis; failure analysis: case studies; Identification of counterfeits; …
D - Microwave Devices and Circuits
Microwave and compound semiconductor devices; devices for 5G communication; radar sensors; …
E - Packaging and Assemblies
E1 – Wafer- and Panel-Level
Interconnection Technologies First level interconnects; 3D-integration and through-silicon-vias; PCB-embedding, fan-out and chip-scale packaging; chip/package interaction; …
E2 – Second-Level Interconnects
Solder and high-temperature interconnects; sinterinterconnects; wire-bonds; …
F - Power Devices and Systems
F1 – Smart Power Devices, IGBT, Thyristors
F2 – Wide Bandgap Power Devices
F3 – Power Electronic Systems
G - Photonics Devices
Solar cells and display; optoelectronics; organic electronics: OLED, electronic ink, TFT
H - MEMS and Sensors
Bio-electronics, bio-sensors, nano-bio-technologies; MEMS and MOEMS; NEMS and nano-objects; …
I - Extreme Environments and Radiation
ESD-EOS, latchup; EMC-EMI (integrated circuits, power electronic systems); radiation impact on circuits and systems reliability
LOCATION AND PROGRAM
Location
H4 Hotel Berlin Alexanderplatz
Program
Monday, September 26, 2022
Tutorials, Opening Cermony, Keynotes, Exhibition Opening and Reception
Tuesday, September 27, 2022
Sessions, Exhibition, Poster Session, Conference Dinner
Wednesday, September 28, 2022
Sessions, Exhibition, Poster Session, Evening Event
Thursday, September 29, 2022
Sessions, Exhibition, Poster Session
Friday, September 30, 2022
Guided Technical Tours
Venue
ESREF 2022 Conference will be hosted in the conference center of the H4 Hotel in Berlin Alexanderplatz. It is located directly near the historic city center at a walking distance. The location offers a multitude of different travel options and different hotels at different budget levels are available on site (H4 and H2 Hotel) and others can be found at a walking distance.
ORGANIZING COMITTEE
Conference Chair
Martin Schneider-Ramelow, TU Berlin and Fraunhofer IZM (D)
Conference Co-Chairs
Andreas Middendorf, Fraunhofer IZM (D)
Olaf Wittler, Fraunhofer IZM (D)
Technical Program Chairs
Francesco Iannuzzo, University of Aalborg (DK)
Frank Altmann, Fraunhofer IMWS Halle (D)
Matteo Meneghini, University of Padova (I)
Olaf Wittler, Fraunhofer IZM Berlin (D)
Industrial Advisory Board Chair
Stefan Wagner, Fraunhofer IZM (D)
Tutorial Chair
Gudrun Feix, ECPE, Nürnberg (D)
Conference Office
Martina Creutzfeldt, mcc Agentur für Kommunikation GmbH (D)
Ajda Omrani, mcc Agentur für Kommunikation GmbH (D)
Stefan Ast, Fraunhofer IZM (D)
STEERING COMMITTEE
F. Altmann, Fraunhofer IMWS-CAM (D)
M. Bafleur, LAAS-CNRS (F)
A. Bensoussan, TAS (F)
C. Boit, TUB – Tech. University of Berlin (D)
G. Busatto, University of Cassino (I)
M. Ciappa, ETH, Zürich (CH)
O. Crepel, AIRBUS, Group Innovation (F)
Y. Danto, IMS, University of Bordeaux (F)
I. de Wolf, IMEC (B)
G. Erikson, GRUNDFOS (DK)
F. Fantini, University of Modena (I)
Ph. Galy, ST Microelectronics (France)
W. Gerling, ECPE (D)
R. Heiderhoff, University of Wuppertal (D)
F. Iannuzzo, University of Aalborg (DK)
N. Labat, IMS, University of Bordeaux (F)
J.R. Lloyd, University of Albany (USA)
F. Marc IMS, University of Bordeaux (F)
M. Meneghini, University of Padova (I)
E. Miranda, University Autonoma Barcelona (E)
E. Olthof, NXP Semiconductors (NL)
G. Papaioannou, University of Athens (G)
Ph. Perdu, ANADEF (F)
C. Salm, University of Twente (NL)
A. Toubul, IMS, University of Bordeaux (F)
M. Vanzi, University of Cagliari (I)
E. Wolfgang, ECPE (D)
W. Wondrak, Daimler Chrysler (D)
CONTACT
Conference Office ESREF 2022
mcc Agentur für Kommunikation
Martina Creutzfeldt
office@esref2022.org
+49 30 61288611
Local Organizing Team ESREF 2022
Fraunhofer IZM
Stefan Ast
office@esref2022.org
+49 30 46403-137