ESREF2022 is expected to return as an on-site event. As an exhibitor, you will have the unique opportunity to market your products and services to a captive audience of buyers, designers, and influential researchers.
Our opening hours are arranged to give exhibitors maximum exposure, and social events are planned in the exhibition space to encourages all delegates to meet and mingle formally and informally. Approx. 20 booths are available on a first-come-first-served basis. We will try to accommodate all of your special needs and requests.
For over 39 years, Allied High Tech Products has provided sample preparation products for failure analysis to the microelectronics industry. Allied manufactures cutting-edge equipment with all design, manufacturing and assembly taking place in-house to ensure the highest quality equipment is produced. Allied’s state-of-the-art tools include the X-Prep® Precision Polishing/Grinding/Milling Machine, MultiPrep™ Polishing System, TechCut™ Sectioning Saws and a range of metallurgical mounting equipment and grinders/polishers. Please stop by Stand #19 for more in-depth information.
Eurofins MASER is an independent engineering service company. Since 1993 we have offered Reliability Test and Failure Analysis Services to the semiconductor and electronic systems industry.
We offer a wide range of qualification procedures (AEC Q100/JEDEC/MIL/IEC) to qualify the products according to the latest international standards or to your specific requirements.
Whether a company is active as Fabless Semiconductor Manufacturer, IC Design House, Electronic Manufacturing Service (EMS) Provider or Original Equipment Manufacturer (OEM) we can support them with their daily Reliability Test or Failure Analysis challenges.
Hamamatsu Photonics is one of a few companies, in the world that develops a wide range of light sensors, such as photodiodes, image sensors and photomultiplier tubes, as well as number of light sources.
Our portfolio of more than 10,000 products does not only include components, but also fully integrated systems, like our new emission microscope PHEMOS X for failure localization in semiconductor devices.
It can be equipped with up to 5 lasers from VIS to NIR for the customized analysis.
Phemos X is prepared for analysis of Logic and Power Devices, including advanced CMOS technologies. Its structure is designed to embed each of those approaches, either individually or „all at once“.
Hitachi Power Solutions develops, produces, and provides ultrasonic inspection systems as well as ultrasonic transducers. We have a long history working in the field of non-destructive inspection as a subsidiary of Hitachi’s electric power business unit for more than 40 years and as a manufacturer of ultrasonic inspection systems applied to electronic devices for 30 years.
Our wide variety of the lineup achieves appropriate selection of the product for various customers‘ samples. Our ultrasonic transducers are manufactured in-house so that can be provided the most proper one for a sample. Transducer customization regarding to the frequency and the focal length is available.
Kleindiek Nanotechnik is a small, flexible high-tech company that specializes in ultra-precise nanopositioning. In recent years, we’ve been focussing on dedicated solutions for electrical fault location and analysis on current and future technology nodes. Our Prober Shuttle platform incorporates up to eight three-axis probers combined with a three-axis substage for easy step and repeat measurements. All 27 axes have positioning resolutions as low as 0.05 nm and are equipped with positional encoders yielding semi-automated workflows. Nanoprobing analyses including EBIC, EBAC, EBIRCH, etc. experiments can be performed with ease. The system is validated on 5 nm and ready for future technologies!
JP Kummer Group is a specialist European distributor of instruments and consumables mainly for the Solar- and Semiconductor Industr. Using our long established relationships within the worldwide Industry we bring the newest and most technologically advanced products to the European market.
We are specalist for: Laser Probing and Emission Detection, wafer thickness, geometry, resistivity, surface inspection, slot-die coating, decapsulator and de-layering systems, SEM/TEM Sample preparation equipment, Scanning Acoustic Microscope, curve tracer, plasma cleaning, Vacuum bake/Vapour prime ovens, x-Ray inspection, calibration standards, MEMS characterization system.
TDM by Insidix is a topography & deformation measurement machine using Projection Moiré for temperature-dependent warpage measurement. We designed our technology for the 3D measurements of complex objects under thermal stress. TDM exerts thermal profiles and cycles on electronics components in the same way as they are imposed on devices during production processes or operations.
TDM has an internal heating/cooling sequence with an optical set-up for 3D topography analysis under thermal stress for all materials, components, and sub-systems. We measure the 3D deformation related to the imposed thermal stress throughout the thermal cycle and reveal the device’s faults.
Acoustic Microscopy / Made in Germany
PVA TePla Analytical Systems GmbH has been a ground-breaking expert in the field of acoustic microscopy for more than 30 years. With a range of leading solutions to suit all industries and fields of technology, we enable our customers to perform reliable non-destructive materials testing—from the inspection of solar and semiconductor systems all the way to failure analyses for ingots used in the production of wafers and MEMS systems.
SECTOR TECHNOLOGIES is a distributor for high-tech products within European Semiconductor Industry . Our focus is the distribution of failure analysis high-end equipment.
New technology introduction requires new tools for failure analysis adapted to the challenges: Lock-in Thermography ( Elite), EMMI and laser scanning microscopy application (Meridian family) and nanoprobing ( nProber IV, Hyperion) from ThermoFisher are products specifically targeted for process development, yield improvement , failure analysis for complex electronics components . For samples preparation and backside SI thinning we have an extended offer : JetEtch, PlasmaEtch and VarioMill .For electrical test (digital, MxSL, Power) : Mutest , Teseda , FocusedTest
EXHIBITION BOOTH RENTAL: FEES & TECHNICAL INFORMATION
Turnkey booths are available at ESREF2022 and can be rented in two different sizes. They include energy supply (230 V), inscription of company name (top) and logo (sideways) and furniture as indicated below.
Please note that additional stand personnel beyond the free exhibition-only registration will have to be registered separately. Additional fittings (e.g., showcases) and energy supply (380 V) can be ordered directly from our booth builder and will be charged separately. Usable room height: 4,05 m, maximum floor load: 3000 kg / qm.
Standard booth (6 m²)
2,800,- € plus 19% VAT when booking before May 31, 2022
3,200,- € plus 19% VAT when booking before August 31, 2022
Includes table, two chairs and one free conference registration (including access to the conference sessions and catering (coffee breaks, cocktails and lunches, but NO conference dinner))
Big booth (12 m²)
4,400,- € plus 19% VAT when booking before May 31, 2022
4,800,- € plus 19% VAT when booking before August 31, 2022
Includes table, two chairs and one free conference registration (including access to the conference sessions and catering (coffee breaks, cocktails, lunches and conference dinner))
300,- € plus 19% VAT (each) Extra free expo only registration
Includes access to the exhibition and catering (coffee breaks, cocktails and lunches, but NO conference dinner)
85,- € plus 19% VAT (each) Extra Gala Dinner
Please also check out the opportunities of supporting the event as a sponsor.
If you want to participate as an exhibitor at ESREF 2022, you can book your booth via ConfTool. In case of any questions about the order or details, please feel free to contact us: firstname.lastname@example.org.
Terms of registration for exhibitors:
- The booking of an exhibition booth is binding.
- Booths will be allocated on a first come, first served basis.
- The exhibition fees are owed upon registration and are payable within 14 days following submission of the registration (but not later than 7 days before the first day of the event).
- Please note that additional stand personnel beyond the one included conference registration will have to be registered separately. Additional fittings (e.g., showcases) and energy supply (380 V) can be ordered directly from our booth builder and will be charged separately.
- If, despite our best efforts, we are not able to organize the exhibition as an on-site event, we will be offering attractive online advertising packages, but exhibitors will also be allowed to cancel their booth registration.
For more information or to secure your exhibition package contact:
Conference Office ESREF 2022
mcc Agentur für Kommunikation
Ajda Omrani & Martina Creutzfeldt
+49 30 61288611