ESREF 2022

33rd European Symposium on Reliability of Electron
Devices Failure Physics and Analysis

September 26-29, 2022

Scope of THE Conference and Abstract Submission



High quality abstracts are accepted for presentation at ESREF and publication in Microelectronics Reliability Journal. They should contribute to reliability concepts, the understanding and analysis of failure mechanisms by means of innovative methods in failure analysis, measurement, characterisation or modelling. During submission the authors will be asked to give their preferences with regard to one or more tracks as described below:


Submission of 4-page extended abstract

Submission is now closed

Notification of acceptance:

May 5, 2022

Final paper (5-6 pages) for review

(Elsevier Editorial System)
June 5, 2022

Final upload to the journal

(Elsevier Editorial System)
July 18, 2022

A - Assessment Techniques and Methods for Devices and Systems

Design for reliability; built-in reliability; virtual qualification; advanced seliability simulation; limits to accelerated tests; screening methods; yield/reliability relationship; counterfeit detection on system level; KI based reliability assessment; condition monitoring; multi-objective reliability assessment techniques; including sustainability aspects in the assessment; …

B - Semiconductor and Nanoelectronics Technologies

Process-related issues, passivation stability; hot carriers injection, NBTI, TDDB; high-K dielectrics and gate stacks; Low-K dielectrics and Cu interconnects; metal migration: mechanical and thermal aspects; non-volatile and programmable cells; silicon on insulator devices; nano-electronics, nano-electronic materials for solid state devices; …

C - Progress in Failure Analysis Methods

Electron, ion and optical beam techniques; scanning probe techniques; static or dynamic techniques, back-side techniques; acoustic microscopy; electric or magnetic field based techniques; electrical, thermal and thermo-mechanical characterization; sample preparation, construction analysis; failure analysis: case studies; Identification of counterfeits; …

D - Microwave Devices and Circuits

Microwave and compound semiconductor devices; devices for 5G communication; radar sensors; …

E - Packaging and Assemblies

E1 – Wafer- and Panel-Level

Interconnection Technologies First level interconnects; 3D-integration and through-silicon-vias; PCB-embedding, fan-out and chip-scale packaging; chip/package interaction; …

E2 – Second-Level Interconnects

Solder and high-temperature interconnects; sinterinterconnects; wire-bonds; …

F - Power Devices and Systems

F1  – Smart Power Devices, IGBT, Thyristors

F2 – Wide Bandgap Power Devices

F3  – Power Electronic Systems

G - Photonics Devices

Solar cells and display; optoelectronics; organic electronics: OLED, electronic ink, TFT

H - MEMS and Sensors

Bio-electronics, bio-sensors, nano-bio-technologies; MEMS and MOEMS; NEMS and nano-objects; …

I - Extreme Environments and Radiation

ESD-EOS, latchup; EMC-EMI (integrated circuits, power electronic systems); radiation impact on circuits and systems reliability


Please submit a 4-page extended summary through our online conference system. In order to submit an abstract, please create a user account in this conference system beforehand. Later, you can also complete your registration for the conference and pay the conference fees through the online platform.


If accepted by the journal, the papers will go through a full peer-review process. All accepted papers will be published in a special issue of the Elsevier Microelectronics Reliability Journal (5-year impact factor: 1.589). Info:


Tutorials by experts will provide review presentation of relevant topics and Invited papers will introduce the mainstream topics. Workshops organized in correlation with the ESREF conference will give the opportunity to discuss recent developments, open issues and exchange the know-how on specific topics.

Registration fees for presenting authors are expected to be about 650 euros. Authors must be present on site and give a presentation in person. Fees for regular participants will be 950 euros (on-site) or 500 euros (online). The aim is to have a face-to-face event. The online format is intended only as a fallback option.